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 GN4014ZB4LD, GN4014ZB4LS, GN4014ZB4LM
Silicon IGBT Ignition Coil Driver
REJ03G1249-0300 Rev.3.00 Jun 01, 2009
Features
* Including Clamping Zener VCL = 400 V(typ) * Low saturation Voltage VCE(sat) = 1.4 V(typ) * SMD package LDPAK
Outline
RENESAS Package code: PRSS0004AE-A (Package name: LDPAK(L))
4
RENESAS Package code: PRSS0004AE-B (Package name: LDPAK(S)-(1))
4 C
1 1 2
2
G 3
1. Gate 2. Collector 3. Emitter 4. Collector
3 E
Absolute Maximum Ratings
(Ta = 25C)
Item Collector to emitter voltage Gate to Emitter voltage Emitter to Collector voltage Collector current Collector peak current Collector power dissipation Junction temperature Storage temperature Notes: 1. Value at Tc = 25C Symbol VCES VGES VECS IC iC(peak) PCNote1 Tj Tstg Ratings 370 20 24 14 18 60 150 -55 to +150 Unit V V V A A W C C
REJ03G1249-0300 Rev.3.00 Jun 01, 2009 Page 1 of 7
GN4014ZB4LD, GN4014ZB4LS, GN4014ZB4LM
Electrical Characteristics
(Ta = 25C)
Item Collector to Emitter breakdown voltage Gate to Emitter breakdown voltage Collector cutoff current Gate cutoff current Collector to emitter saturation voltage Collector to emitter saturation voltage Gate to emitter cutoff voltage Turn-on delay time Rise time Turn-off delay time Fall time Input capacitance Output capacitance Reveres transfer capacitance Secondary breakdown energy Symbol V(BR)CES V(BR)GES ICES IGES VCE(sat)1 VCE(sat)2 VGE(off) td(on) tr td (off) tf Ciss Coss Cres Es/b Min 370 20 -- -- -- -- 1.3 -- -- -- -- -- -- -- 230 Typ 400 -- -- -- 1.4 1.6 -- 0.2 0.4 1.0 5 1110 75 18 -- Max 430 -- 100 100 1.7 2.2 2.2 -- -- -- -- -- -- -- -- Unit V V A A V V V s s s s pF pF pF mJ Test Conditions Ic = 2 mA, VGE = 0 V IG = 100 A, VCE = 0 V VCE = 300 V, VGE = 0 V VGE = 20 V, VCE = 0 V IC = 8 A, VGE = 10 V IC = 8 A, VGE = 4 V IC = 1 mA, VCE = 10 V VCE = 300 V, RL = 50 , VGE = 5 V, RG = 200
VCE = 10 V, VGE = 0, f = 1 MHz L = 5 mH
REJ03G1249-0300 Rev.3.00 Jun 01, 2009 Page 2 of 7
GN4014ZB4LD, GN4014ZB4LS, GN4014ZB4LM
Main Characteristics
Power vs. Temperature Derating
80 100
Maximum Safe Operation Area
Pc (W)
IC (A)
60
10
DC
PW
Collector Dissipation
Op
=
Collector Current
er
10
ati
m
on
s(
1m
10 s 10 0 s
40
1
(T
1s
s
c=
ho
t)
25
C )
20
0.1
Ta = 25C 0 0 0.01 50 100 150 200 1 3 10 30 100 300 1000
Case Temperature
Tc (C)
Collector to Emitter Voltage VCE (V)
Collector to Emitter Breakdown Voltage vs. Case Temperature
Collector to Emitter Breakdown Voltage V(BR)CES (V)
500 10
Typical Output Characteristics
10 V 15 V 8 6V 4V Pulse Test
450
IC (A) Collector Current
6
400
4
350 IC = 2 mA 0 50 100 150
2 0 0 2 4
VGE = 2 V 6 8 10
300 -50
Case Temperature
Tc (C)
Collector to Emitter Voltage VCE (V) Collector to Emitter Saturation Voltage vs. Gate to Emitter Voltage
Collector to Emitter Saturation Voltage VCE(sat) (V)
5 Pulse Test 4
Typical Transfer Characteristics
20 VCE = 10 V Pulse Test 16
IC
12
(A)
Collector Current
3 IC = 10 A
8 Tc = 125C 25C -40C 0 0 1 2 3 4 5
2
4
1 0
8A
6A
0
4
8
12
16
20
Gate to Emitter Voltage
VGE (V)
Gate to Emitter Voltage
VGE (V)
REJ03G1249-0300 Rev.3.00 Jun 01, 2009 Page 3 of 7
GN4014ZB4LD, GN4014ZB4LS, GN4014ZB4LM
Collector to Emitter Saturation Voltage vs. Collector Current
Collector to Emitter Saturation Voltage VCE(sat) (V)
10 5 10000 3000
Typical Capacitance vs. Collector to Emitter Voltage
Capacitance C (pF)
Cies 1000 300 100 30 Cres 10 3 1 VGE = 0 f = 1 MHz 0 10 20 30 40 50 Coes
2 1 0.5
-40C
25C
Tc = 125C
0.2 0.1 0.1
VGE = 10 V Pulse Test 0.3 1 3 10 30 100
Collector Current
IC
(A)
Collector to Emitter Voltage VCE (V)
Dynamic Input Characteristics
VCE (V) VGE (V)
50 IC = 10 A Ta = 25C VCE = 16 V 20 VGE 10 3 1 0.3 0.1
Switching Characteristics
tf
40
16
Collector to Emitter Voltage
Switching Time t (s)
30
12
Gate to Emitter Voltage
td(off) tr
20
8
10 VCE 0 20 40 60 80
td(on) 0.03 0.01 0.1 VCC = 300 V, VGE = 10 V Rg = 200 , Ta = 25C 0.2 0.5 1 2 5 10
4
0
0 100
Gate Charge
Qg (nc)
Collector Current
IC (A)
100 50 20 10 5 2 VCC = 16 V 1 0.1
VGE = 10 V, Rg = 200 Tc = 140C 25C
Secondary breakdown energy Es/b (mJ)
Secondary Breakdown Current vs. Inductance Ratio
ISC (A)
Secondary Breakdown Energy vs. Case Temperature
1000 500 200 100 50 20 10 25
VCC = 16 V, L = 5 mH VGE = 10 V, Rg = 200
Secondary breakdown Current
0.2
0.5
1
2
5
10
50
75
100
125
Inductance Ratio L (mH)
Case Temperature Tc (C)
REJ03G1249-0300 Rev.3.00 Jun 01, 2009 Page 4 of 7
GN4014ZB4LD, GN4014ZB4LS, GN4014ZB4LM
Normalized Transient Thermal Impedance vs. Pulse Width
3
Normalized Transient Thermal Impedance s (t)
Tc = 25C 1 D=1 0.5 0.2 0.1 0.1
0.05
0.3
0.03
0.02
0.01
0.05
1s
t ho
pu
lse
ch - c(t) = s (t) * ch - c ch - c = 2.08C/W, Tc = 25C PDM PW T 100 1m 10 m 100 m 1 10 D= PW T
0.003 0.001 10
Pulse Width
PW (S)
Switching Time Test Circuit
Ic Monitor R Vin Monitor Vin 10%
Waveform
90%
90% Rg D.U.T. VCC Ic Vin = 10 V td(on) ton 10% tr
90%
10 % td(off) toff tf
REJ03G1249-0300 Rev.3.00 Jun 01, 2009 Page 5 of 7
GN4014ZB4LD, GN4014ZB4LS, GN4014ZB4LM
Package Dimensions
Package Name LDPAK(L) JEITA Package Code RENESAS Code PRSS0004AE-A Previous Code LDPAK(L) / LDPAK(L)V MASS[Typ.] 1.40g
Unit: mm
(1.4)
4.44 0.2 10.2 0.3 1.3 0.15
11.3 0.5 0.3 10.0 + 0.5 -
8.6 0.3
1.3 0.2 1.37 0.2
0.76 0.1 2.54 0.5 2.54 0.5
11.0 0.5
0.2 0.86 + 0.1 -
2.49 0.2
0.4 0.1
Package Name LDPAK(S)-(1)
JEITA Package Code SC-83
RENESAS Code PRSS0004AE-B
Previous Code LDPAK(S)-(1) / LDPAK(S)-(1)V
MASS[Typ.] 1.30g
Unit: mm
4.44 0.2 10.2 0.3
(1.4)
8.6 0.3
+ 0.3 - 0.5
10.0
(1.5)
(1.5)
2.49 0.2 0.2 0.1 + 0.1 -
7.8 7.0
2.2
1.37 0.2 1.3 0.2 2.54 0.5
0.3 3.0 + 0.5 -
0.2 0.86 + 0.1 -
0.4 0.1
2.54 0.5
REJ03G1249-0300 Rev.3.00 Jun 01, 2009 Page 6 of 7
1.7
1.3 0.15
7.8 6.6
GN4014ZB4LD, GN4014ZB4LS, GN4014ZB4LM
Ordering Information
Part Name GN4014ZB4LD GN4014ZB4LS GN4014ZB4LM Quantity 50 pcs. 1000 pcs. 1000 pcs. Sack Taping Taping Shipping Container
REJ03G1249-0300 Rev.3.00 Jun 01, 2009 Page 7 of 7
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
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(c) 2009. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2


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